Qualcomm Achieves 20Mbps Data Call on HSPA+ Equipment

In a press release on Thursday, Qualcomm has announced that it has achieved a simultaneous data call of 20Mbps by utilizing the currently sampling MDM8200 chipset solution.  The chipset solution, along with the further refinement of HSPA Release 7 which is also known as HSPA Evolved, is expected to hit a theoretical maximum downlink of between 42-84Mbps and a theoretical maximum uplink of 23 Mbps.

AT&T has previously committed to increasing 3G network speeds to 20Mbps per second, but it is not known if Qualcomm’s solution is involved or if they are utilizing another competing manufacturer for the upgrade.